Figure 3

Failure-oriented-accelerated-testing (FOAT) and its role in assuring electronics reliability: review

E Suhir*

Published: 06 January, 2023 | Volume 6 - Issue 1 | Pages: 001-018

ijpra-aid1048-g003

Figure 3:

Figure 3: In an analytical thermal stress model the solder joints were approximated as short circular cylinders (left sketch), whose plane surfaces were subjected, at low-temperature conditions, to radial tension; the highest stresses and strains acted, however, in the axial direction (right sketch).

Read Full Article HTML DOI: 10.29328/journal.ijpra.1001048 Cite this Article Read Full Article PDF

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